分类： Industry Insights

Price Overview

Material	Current Price Range	WoW Change	Trend
PTFE Resin	General grade RMB 50k–54k/t; Electronic grade RMB 150k–300k/t	+2%~+5%	Rising
PEEK Resin	Domestic industrial RMB 400–600/kg; Imported RMB 800–1,500/kg	0%	Stable
Carbon Fiber	T300/12K RMB 80–90/kg; T700/12K RMB 120–150/kg	+1.5% (full range +5~10%)	Rising
PI Film	Electrical grade RMB 110–220/kg; Electronic grade RMB 1–3M/t	Electronic +2%	Divergent
Specialty Ceramic Raw Materials	Zirconia RMB 56k/t (general)/Fused ZrO₂ RMB 27k–33k/t; Alumina RMB 3,350–3,950/t	Zirconia +1% (YTD +29%)	Rising

Key Movements

• PTFE Resin: General grade +2%, electronic grade +5%. NVIDIA adopted PTFE as the core material for its Rubin Ultra orthogonal backplane, driving surging AI-computing demand. Combined with rising fluorspar/hydrofluoric-acid costs and the industry’s “volume-control, price-protection” stance, the price center keeps climbing; high-end electronic-grade PTFE has exceeded RMB 150k/t.
• Carbon Fiber: Zhongfu Shenying disclosed on Sept 7 that it raised all product lines by 5%–10% starting in August — a strategic price calibration after half a year. Toray raised prices 10%–20% from January and Jilin Chemical Fiber followed. The core driver is acrylonitrile costs pressured by high, volatile international crude (Brent ~US$90/bbl); the company’s raw-material purchase cost rose 13.6% YoY in a single quarter, confirming a bottom reversal.
• Specialty Ceramic Raw Materials (Zirconia): General zirconia is up 29% YTD to RMB 56k/t; Sinocera raised powder prices 10%–40% from July 27; high-end fused zirconia touched RMB 33.5k/t. Zircon sand stays high (65% grade RMB 11.9k–12.5k/t), yttria export controls lifted YSZ costs, and demand from PCB grinding media, MLCC, and solid-state batteries is converging.
• PEEK Resin: Prices stable. Domestic players (Zhongyan, Junhua) keep expanding, and substitution is pressing down mid/low-end prices; imported Victrex and other high-end grades stay elevated at RMB 800–1,500/kg on tight supply.
• PI Film: Electrical grade (RMB 110–220/kg) steady; electronic grade +2%. Kaneka raised all PI film prices 20% in April; the global electronic-grade PI film supply gap is locked through 2027, with AI servers, advanced packaging, and foldable displays driving high-end demand.

Impact Analysis

• Procurement cost: PTFE, zirconia, and high-end PI film keep rising, lifting budgets for fluoropolymer and functional-ceramic products (recommend +5%–10% uplift); carbon fiber and PEEK supply is ample, keeping overall cost pressure contained.
• Supply chain: High-end PI film and high-end zirconia are highly import-dependent; overseas supply cuts and long-term lock-ins by major customers tighten supply elasticity — watch FX and geopolitical logistics risks. Carbon fiber and PEEK have ample domestic supply, improving buyer leverage.

Actionable Recommendations

• Lock in now: PTFE (especially electronic grade), high-end electronic PI film, yttria-stabilized zirconia — clear upward trend; sign 3–6 month contracts to lock prices.
• Watch / hold: PEEK industrial grade (domestic expansion pressing prices, buy opportunistically in batches); carbon fiber T300 (bottom-range oscillation, build positions in batches, no need to chase highs).

1. Executive Summary

In this issue (2026-09-09) we monitor six hot materials: PTFE (polytetrafluoroethylene), PEEK (polyether ether ketone), carbon fiber, special ceramics, electronic chemicals, and aerogel. The industry theme is consistent: premiumization, localization, and the dual engine of new energy and AI compute. Search heat and competition rise together, but opportunity windows diverge — aerogel and electronic chemicals show a deterministic breakout driven by mandatory regulation and import substitution; PTFE and PEEK are being re-rated by AI servers and semiconductor equipment; carbon fiber is tight at the high end and cheaper at the industrial end; high-end special-ceramic powders remain bottlenecked overseas.

2. Heat × Competition × Trend Matrix

Material	Search Heat	Competition	Trend	Core Driver	Key Data
PTFE	Very High	Medium (high-end grades monopolized overseas)	Strong rebound ↑	AI compute copper-clad laminates / semiconductor localization / new energy	Price +23.81% YoY; global USD 11.86B
PEEK	Very High	High (CR5≈78%)	High growth ↑	Aerospace / semiconductor equipment / medical implants	Global USD 9.27B, +11.8%
Carbon fiber	Very High	Medium-High (divergent)	Price-rebound recovery ↑	Wind turbine scaling / eVTOL / humanoid robots / commercial space	Local self-sufficiency 86%; T800+ tight
Special ceramics	Very High	High (high-end monopolized by JP/DE/US)	Steady growth ↑	Semiconductor equipment precision ceramics / new-energy power devices / AI thermal	Global USD 89.24B, +7.8%
Electronic chemicals	Very High (highest)	High (high-end bottleneck)	Breakout ↑	AI+HBM+advanced packaging / localization	Global USD 72.0B, +18.6%
Aerogel	Very High	Medium (concentrated leaders)	Breakout ↑	Power-battery new standard GB38031 / storage safety / green building	Global USD 3.86B, +23.7%

3. Category Deep-Dive

1. PTFE — The “Plastic King” Meets the AI Era

Market data: In June 2026 major fluoropolymer producers raised all product lines by 5%; as of June 5 price reached 52,000 RMB/ton, up 11.83% QoQ and 23.81% YoY. Global market about USD 11.86B; Asia-Pacific 58.3% of consumption; China 67.2% of capacity, but high-end electronic grade import dependence ~21.5%.

Opportunity: AI server orthogonal backplanes drive mass adoption of electronic-grade PTFE; PTFE for copper-clad laminates reaches USD 2.84B by 2035 (CAGR 9.0%); high-purity semiconductor PTFE demand +14.6%, hydrogen energy +22.3%. Electronics is now the largest application (31.2%).

Risk: EU PFAS restriction suppresses traditional grades; high-end electronic grade monopolized by Daikin, Chemours, Rogers — domestic players still in validation / small-batch trial.

Action: Bind content to the “Nvidia Rubin Ultra + high-speed board” narrative; track electronic-grade grade validation at Haohua Tech and Dongyue Group.

2. PEEK — Transition to a Strategic Base Material

Market data: 2026 global ~USD 9.27B, +11.8% YoY; capacity 28,500 ton/yr, CR5≈78.3% (Victrex leads at 40.2%). China capacity share rose to 27.4%. Aerospace is the largest application (34.5%); semiconductor-equipment PEEK demand +18.7%.

Opportunity: Medical implant grade margin 18-25 pts above industrial; 3D-printing PEEK powder CAGR 27.5%; China high-end grade import dependence still 41% — large substitution space.

Risk: High oligopoly barrier; EU CBAM expands to high-performance polymers with mandatory carbon-footprint reporting on imports.

Action: Focus long-tail on “semiconductor wafer carriers / CMP retain rings / medical implant grade”; track certification at Zhongyan, Junhua.

3. Carbon Fiber — Tight at High End, Cheaper at Industrial End

Market data: H1 2026 price rally (Jilin Chemical, Hengsheng +5,000-10,000 RMB/ton); local self-sufficiency hit a record 86%. T300 80-90 RMB/kg, T700 100-140 RMB/kg, T800 180-240 RMB/kg. Wind-blade penetration 18%→41%; large-tow demand growth >30%. Global demand 220 kt (+43%), 560 kt by 2030.

Opportunity: Domestic 48K large-tow lines on stream, average price back to 70 RMB/kg, lowering industrial adoption threshold; humanoid robots (5-7 kg T1000 each), eVTOL, commercial space pull high-end demand.

Risk: Mid-low-end overcapacity and price war; T800+ high-end grades carry certification barriers and firm pricing.

Action: Split content into “industrial cost-down” vs “aerospace-grade shortage”; anchor procurement to wind/solar and low-altitude-economy customers.

4. Special Ceramics — The Invisible Base of Semiconductors and New Energy

Market data: 2026 global ~USD 89.24B (+7.8%); electronic functional ceramics USD 128.46B (+9.2%). Asia-Pacific 58.3%, China ~480B RMB. SiC-based is the largest segment at 34.2%; semiconductor front-end equipment ceramic parts +12.4%, new-energy ceramics >20%.

Opportunity: AlN/Si3N4 power-device substrates, electrostatic chucks (ESC), focus rings ramping; high-end Si3N4/SiC localization rate <30% — substitution window open.

Risk: High-end powder purity and batch consistency monopolized by JP/DE/US; M&A consolidation raising barriers.

Action: Differentiate into “SiC/AlN power-device thermal” segment; track automotive-grade breakthroughs at Sinocera, Chaozhou Three-Circle.

5. Electronic Chemicals — The Blood of Chips, Localization Breakout Year

Market data: 2026 global ~USD 72.0B (+18.6%); China 235B RMB (CAGR 13.8%), >35% of global. Semiconductor-grade chemicals USD 48.62B (+11.1%). Six tracks: photoresist & ancillaries, wet electronic chemicals, specialty electronic gases, CMP materials, packaging materials, battery chemicals.

Opportunity: G3-and-below wet chemicals localized 75%, but G5 only 12%, ArF photoresist <8%, high-end specialty gas <10%. 2026 is widely called the "domestic photoresist breakout year" — breakthroughs at Darrow (330t ArF/KrF line), TechWare, Downstream/OEM.

Risk: High-end customer qualification 6-24 months; feedstock (high-purity gas) geopolitics (Qatar helium, Russia export control).

Action: Prioritize deep content on “ArF photoresist / G5 wet-chemical localization”; source suppliers already qualified by top fabs.

6. Aerogel — From Noble Material to Must-Have New Material

Market data: 2026 global USD 3.86B (+23.7%), China USD 1.59B (41.3%). Power-battery insulation penetration 8%→23%; production cost down 42% vs 2020. New-energy battery 34.7% of applications, storage 27%, building 18.3%.

Opportunity: GB38031-2025 (effective 2026-07-01) upgrades thermal-propagation protection from “alarm/escape” to “suppress propagation” — aerogel becomes mandatory; GB/T 46993-2025 opens the building market. Ambient-pressure drying replacing supercritical cuts cost another 20-30%.

Risk: Generic capacity saturated and homogenized; high-end automotive/storage grades scarce with high compliance barriers.

Action: Use “GB38031 compliance solution” as traffic entry; watch capacity and certification at Aspen, Hualu, Nano.

4. Action Recommendations (Content + Intelligence)

• Content priority: Aerogel GB38031 compliance, ArF photoresist localization (highest heat, high competition = high-value traffic).
• Narrative binding: PTFE/PEEK tied to AI compute and semiconductor localization, leveraging Nvidia Rubin and HBM topics.
• Differentiation: Carbon fiber split into “industrial cost-down vs aerospace-grade shortage”; special ceramics lock SiC/AlN thermal segment.
• Intelligence anchor: Long-tail keywords written to content-pipeline/keywords/2026-09-09.md for topic and sourcing.

Sources: industry reports, broker research, public trade-media data (2026-08 to 2026-09). Market intelligence only, not investment advice.

Upcoming Exhibitions

Exhibition	Date	Location	Scale	Exhibiting Value
International Composites Summit (ICS) 2026	Dec 1–2, 2026	Wembley, London, UK	250+ attendees / 30+ exhibitors	Free, focused composites value-chain networking
Ceramics Vietnam (ASEAN Ceramics)	Dec 2–4, 2026	Hanoi, Vietnam	350+ brands / 3,500+ visitors	Largest SE Asia ceramics platform
JEC Forum Middle East	Dec 8–9, 2026	Riyadh, Saudi Arabia	B2B meetings + conference	GCC composites sourcing gateway
Shanghai Int’l Fluoroplastics Industry Chain Expo	Dec 9–11, 2026	SNIEC, Shanghai	30,000+ visitors expected	PTFE / fluoropolymer × semiconductor crossover
ICERP 2026 (India Composites)	Dec 14–16, 2026	Mumbai, India	18,000 m² / 350–500 exhibitors	Asia’s 2nd largest composites show
ICACC 2027 (Advanced Ceramics)	Jan 24–29, 2027	Daytona Beach, USA	ACerS conf. + expo	High-end ceramics / defense R&D entry
COMPOSITE Poland 2027	Jan 19–21, 2027	Warsaw (Ptak Expo)	C. & E. Europe gateway	E. European auto / aerospace buyers
JEC World 2027	Mar 2–4, 2027	Paris Nord Villepinte	1,400+ exhibitors / 45,000+ visitors	World’s largest composites show

Priority Recommendations

• JEC World 2027 (Paris): The global flagship composites event — 1,400+ exhibitors and buyers from 94 countries — is the prime gateway for PTFE, PEEK and carbon fiber into Europe and worldwide. Action: lock a Hall 6 booth via the China Composites Industry Association group now to secure early-bird pricing; prepare English collateral and EU compliance docs (REACH, etc.); budget USD 30k–100k+.
• Shanghai Int’l Fluoroplastics Industry Chain Expo (Dec): Co-located with the Semiconductor Exhibition, it covers the full fluoropolymer chain — a cost-effective Q4 PTFE touchpoint. Action: confirm a booth in Sept–Oct (≈RMB 30k / 9 m²); highlight semiconductor and new-energy application cases.

Registration Reminders

• ICACC 2027 abstract submission closed Sep 15; contact ACerS now to secure exhibitor space (10×10 from ~USD 10k).
• JEC World 2027 early-bird booth window is limited — confirm China group booking this quarter.
• ICS London and COMPOSITE Poland still have space, but ICS uses limited table-top pods — book soon.

Cost Estimates

• Booth fees: domestic standard ≈ RMB 12k–30k / 9 m², raw space RMB 1,200–1,800 / m²; international (JEC/ICACC) raw space ≈ €400–700 / m² or from ~USD 10k / 9 m².
• Travel budgets: domestic RMB 3k–8k / person; SE Asia / Middle East / India ≈ RMB 10k–20k; Europe (Paris) ≈ RMB 30k–50k; US ≈ RMB 25k–40k.

2026-09-08 Price Trend Daily Report

Price Overview

Material	Current Price Range	WoW	Trend
PTFE Resin	¥32,000–48,000/t (general); electronic grade ~¥150,000/t	+1.5%	Firm / range-bound up
PEEK Resin	Domestic neat ¥200–400/kg; Imported ¥800–1,500/kg	+1.0%	Stable with mild upside
Carbon Fiber	T300(12K) ¥85–95/kg; Large-tow ¥72–80/kg	+1.0%	Bottoming, stabilizing
PI Film	Standard ¥20–50/m²; High-performance ¥80–200/m²	0%	Stable (high-end tight)
Specialty Ceramic Raw Materials	ZrO₂ powder ¥18,000–33,500/t; Al₂O₃ ¥3,400–3,900/t	+2.5%	Divergent (Zr up, Al steady)

Key Movements

• Zirconia (specialty ceramics): Sinocera (Guocai) raised zirconia powder prices 10%–40% from July 27. Upstream zircon sand remains elevated (¥11,900–12,500/t) as overseas miners curb output and tighten China quotas; yttria surged on rare-earth export controls, and PCB/solid-state-battery grinding-media demand expanded — a triple driver making this the clearest gainer of the period.
• PTFE Resin: +1.5%. Protected fluorspar mining and tight anhydrous HF support costs; producers are holding prices up. NVIDIA Rubin Ultra orthogonal backplanes add high-end electronic-grade demand, but downstream just-in-time buying and new capacity cap gains — a cost-push, range-bound uptrend.
• PI Film: After Kaneka’s +20% list-price hike in April, electrical-grade prices stabilized from August (mono-axial ¥120/kg, bi-axial ¥180/kg, flat MoM). High-end electronic/semiconductor grades remain supply-tight with high import dependence and firm pricing.
• Carbon Fiber: Bottom confirmed. Toray raised prices 10%–20% and Jilin Chemical Fiber followed early in the year, but high industry inventory and new capacity from Zhongfu Shenying cap the rebound — overall bottoming and stabilizing.
• PEEK Resin: Humanoid robots, EVs, medical and aerospace demand keep expanding; domestic substitution caps mid/low-end prices while high-end holds firm — stable with mild upside.

Impact Analysis

• Procurement cost: Rising zirconia and PTFE costs flow directly into structural ceramics, seals, anti-corrosion linings and grinding media; related purchasing budgets should be raised 5%–10%.
• Supply chain: Fluorochemical and zirconia supply is tight with extended lead-time risk; carbon fiber and PEEK are amply supplied with stronger buyer leverage. High-end PI film is import-concentrated (DuPont, Kaneka, SKC) — disruption risk outweighs price risk under geopolitical friction.

Action Recommendations

• Lock in prices: PTFE resin and zirconia powder — uptrends are clear; sign long-term agreements or lock orders early, and secure Q4 zirconia volume now.
• Wait and see: Carbon fiber (high inventory, weak rebound — wait for better pricing) and PEEK (domestic substitution pressures prices — buy in batches to average cost).
• Watch: High-end electronic-grade PI film is supply-tight; lock critical-project volumes and build dual sourcing.

1. Executive Summary

All six trending keyword clusters sit in a “high heat, high value, mid-to-high competition” zone this cycle. The underlying drivers are remarkably consistent: AI compute infrastructure + new energy (storage / hydrogen / EV) + semiconductor localization.

• Highest heat: Electronic Chemicals and Aerogel — dual policy-and-demand momentum, leading the industry in growth (+13.8% / +17%–25% YoY).
• Fiercest competition: Carbon Fiber and PEEK — mature segments with many players, yet high-end grades remain overseas-dominated, leaving structural substitution windows.
• Best opportunity: High-end localization keywords (electronic-grade PTFE, G5 ultra-pure wet chemicals, silicon-nitride ceramics, T800 carbon fiber) — moderate search competition but high commercial value and policy certainty.

2. Heat & Competition Overview

Keyword	2026 Market Size (representative)	Growth	Heat (1-10)	Competition (1-10)	Core Driver
PTFE (Polytetrafluoroethylene)	~USD 11.86B global	+6.8%	8	6	AI CCL, semiconductor, new energy
PEEK (Polyetheretherketone)	~USD 1.28–11.2B global (range)	+8%–15%	8	7	Humanoid robots, EV, medical implants
Carbon Fiber	~USD 21–41.2B global (range)	+11%–18%	7	8	Hydrogen storage, wind, low-altitude economy
Advanced Ceramics	~USD 84.7–128.4B global (range)	+7%–11%	7	7	Semi equipment, new energy, biotech
Electronic Chemicals	~RMB 235B (China)	+13.8%	9	8	AI compute / HBM, localization
Aerogel	~USD 2.86–6.8B global (range)	+17%–25%	9	7	EV battery thermal, building insulation

3. Material-by-Material Analysis

1. PTFE — “The King of Plastics” meets the AI moment

Data: Multiple fluorochemical producers raised all fluoropolymer prices by 5% from June 1, 2026; price reached RMB 52,000/t, +23.81% YoY. Global market ~USD 11.86B; APAC 58.3%, China 67.2% of capacity, but high-end electronic grade still led by Daikin/Chemours.

Trend: Nvidia Rubin Ultra boosts electronic-grade PTFE for orthogonal backplanes / high-speed boards; semiconductor cleaning equipment demand +30% (2025); EV seals & LIB separator coatings >15% CAGR. EU PFAS regulation is a long-term variable.

Keyword opportunities: electronic-grade PTFE, high-frequency CCL, semiconductor cleaning liner, localization.

2. PEEK — humanoid robots ignite the second curve

Data: 2026 global size ~USD 1.28–11.2B (range), +8%–15%; APAC 42.5%–54%, China >60%. Victrex still ~31%–41% share; China localization rate rose from <12% (2020) to 28.7% (2026).

Trend: ~6.6kg PEEK per humanoid robot — 1M units imply ~3,800t demand; EV per-vehicle use >350g; 3D-printing PEEK filament CAGR ~27.5%; medical-grade PEEK margin 18–25pp above industrial.

Keyword opportunities: PEEK humanoid robot joints, CF-reinforced PEEK, implantable medical PEEK.

3. Carbon Fiber — hydrogen storage is the biggest increment

Data: 2026 global demand 158–186 kt, market USD 21–41.2B; APAC 46%–53%, China 57.8% of capacity. Mordor projects 18.06% CAGR 2026–2031.

Trend: Pressure vessels (hydrogen) fastest-growing at +23.6% to 34 kt; wind blades still largest application (27.4%); T800+ high-end still has a 12–17 kt gap; China high-end self-sufficiency ~41%–47%.

Keyword opportunities: Type-IV hydrogen tank, T800 carbon fiber, low-cost large-tow, recycled carbon fiber.

4. Advanced Ceramics — semiconductor equipment drives functional ceramics

Data: 2026 global ~USD 84.7–128.4B, +7%–11%; APAC 52%–58%. Electronics & semiconductor = 37% of demand; SiC-based ceramics 34.2% (largest segment); Si3N4 fastest at +14.2%.

Trend: Semiconductor electrostatic chucks, EV ceramic bearings, SOFC electrolytes ramping; China high-end self-sufficiency <60%, Si3N4/AlN localization <30%.

Keyword opportunities: aluminum-nitride ceramic substrate, SiC power devices, silicon-nitride bearing balls.

5. Electronic Chemicals — localization deepening

Data: 2026 China market >RMB 235B, CAGR 13.8%; six core tracks (photoresist, wet chemicals, specialty gases, CMP, packaging materials, battery chemicals) = 91%.

Trend: Mid-low end largely substituted (G3 wet chemicals 75% self-sufficiency), but G5 ultra-pure wet chemicals only ~12%, high-end ArF photoresist <8%, specialty gases 15%–25%. AI compute, HBM, advanced packaging are core engines; Big Fund III RMB 160B, ~70% to equipment & materials.

Keyword opportunities: G5 ultra-pure wet electronic chemicals, ArF photoresist, electronic-grade PFA, high-purity specialty gases.

6. Aerogel — EV battery thermal management explodes

Data: 2026 global ~USD 2.86–6.8B, +17%–25%; China market ~RMB 13B, 52.7% of global capacity. By 2030 global could reach USD 8.1–9.2B, CAGR ~20%.

Trend: EV battery insulation pads’ share rose from 17% to 23% — fastest segment (+34% YoY); ambient-pressure drying 68.5% of capacity, cost 20%–30% below supercritical; oil & gas pipeline insulation still 41%.

Keyword opportunities: aerogel EV battery insulation, ambient-pressure aerogel, aerogel coatings.

4. Long-tail Keywords to Prioritize (8)

1. PTFE high-frequency CCL AI server application
2. PEEK humanoid robot joint material localization
3. Carbon fiber Type-IV hydrogen storage tank
4. Aluminum nitride silicon carbide power device ceramic substrate
5. G5 ultra-pure wet electronic chemicals localization
6. Aerogel power battery insulation sheet new energy
7. Electronic-grade PTFE semiconductor cleaning localization
8. Ambient-pressure drying aerogel low-cost mass production

5. Action Recommendations

• Content: Prioritize high-heat / mid-competition long-tails (G5 wet chemicals, electronic-grade PTFE, aerogel battery insulation) to capture localization search dividends.
• Competition avoidance: Carbon fiber and PEEK are saturated at the head — enter via “application scenario + localization” rather than generic terms.
• Monitoring: Weekly track PTFE pricing, HBM/advanced-packaging capacity, and aerogel capacity commissioning as heat-calibration anchors.

Sources: public industry reports, brokerage research, authoritative media (Jul–Sep 2026). For market-intelligence reference only.

This report monitors price trends of five key advanced materials: PTFE resin, PEEK resin, carbon fiber, PI film, and specialty ceramic raw materials. Overall, high-end electronic materials remain firm on AI-server, HBM and low-altitude-economy demand, bulk fluoropolymers consolidate at highs, carbon fiber is bottoming and rebounding, and specialty ceramic raw materials are edging up mildly.

Price Overview

Material	Current Price Range	Weekly Change	Trend
PTFE Resin (Susp. Medium)	¥32,000–34,000/ton	+1%	Firm-Stable
PEEK Resin (Domestic Std.)	¥300,000–400,000/ton	+1%	Slight Up
Carbon Fiber (T300/T700)	¥80–150/kg	+1%	Bottom Reversal
PI Film (Std./High-End)	¥240,000–3,000,000/ton	0%~+0.5%	High-End Strong
Specialty Ceramic Raw Mats.	¥2,700–300/kg	+0.5%	Mild Rise

Key Movements

• PTFE Resin: +1% (Consolidating at highs after a ~30% surge in July; fluorspar/HF-acid cost support persists, and the industry’s “output control & price protection” discipline stays firm)
• Carbon Fiber: +1% (Bottom reversal confirmed. Toray’s Jan +10–20% hike and Jilin Chemical Fiber follow-through, plus low-altitude-economy eVTOL demand, with inventories falling from highs)
• High-End PI Film: Firm (Kaneka raised all PI film prices 20% in April; AI-server/Rubin and HBM demand lock the high-end electronic-grade supply deficit through 2027)

Impact Analysis

• Procurement Cost: PTFE at a relative high pressures anti-corrosion/sealing costs — lock 2–3 months of inventory. Carbon fiber at historic lows benefits wind-blade and aero-composite buyers. High-end PI film is costly — place orders 3 months ahead.
• Supply Chain: PTFE fluorspar tightness extends supplier lead times; carbon fiber’s ~86% localization boosts autonomy; high-end PI/PEEK remain import-dependent — watch FX and geopolitical logistics risk.

Action Recommendations

• Lock In Now: PTFE resin (cost-push, hard to fall — lock 2–3 months immediately), High-end PI film (supply deficit — pre-stock)
• Hold & Watch: Carbon fiber (rebound but high inventory — buy in batches), PEEK industrial grade (domestic capacity caps price — JIT), Specialty ceramic raw materials (ample supply — JIT)

This report monitors price trends of five key advanced materials: PTFE resin, PEEK resin, carbon fiber, PI film, and specialty ceramic raw materials. Overall, high-end electronic materials remain firm on AI-server, HBM and low-altitude-economy demand, bulk fluoropolymers consolidate at highs, carbon fiber is bottoming and rebounding, and specialty ceramic raw materials are edging up mildly.

Price Overview

Material	Current Price Range	Weekly Change	Trend
PTFE Resin (Susp. Medium)	¥32,000–34,000/ton	+1%	Firm-Stable
PEEK Resin (Domestic Std.)	¥300,000–400,000/ton	+1%	Slight Up
Carbon Fiber (T300/T700)	¥80–150/kg	+1%	Bottom Reversal
PI Film (Std./High-End)	¥240,000–3,000,000/ton	0%~+0.5%	High-End Strong
Specialty Ceramic Raw Mats.	¥2,700–300/kg	+0.5%	Mild Rise

Key Movements

• PTFE Resin: +1% (Consolidating at highs after a ~30% surge in July; fluorspar/HF-acid cost support persists, and the industry’s “output control & price protection” discipline stays firm)
• Carbon Fiber: +1% (Bottom reversal confirmed. Toray’s Jan +10–20% hike and Jilin Chemical Fiber follow-through, plus low-altitude-economy eVTOL demand, with inventories falling from highs)
• High-End PI Film: Firm (Kaneka raised all PI film prices 20% in April; AI-server/Rubin and HBM demand lock the high-end electronic-grade supply deficit through 2027)

Impact Analysis

• Procurement Cost: PTFE at a relative high pressures anti-corrosion/sealing costs — lock 2–3 months of inventory. Carbon fiber at historic lows benefits wind-blade and aero-composite buyers. High-end PI film is costly — place orders 3 months ahead.
• Supply Chain: PTFE fluorspar tightness extends supplier lead times; carbon fiber’s ~86% localization boosts autonomy; high-end PI/PEEK remain import-dependent — watch FX and geopolitical logistics risk.

Action Recommendations

• Lock In Now: PTFE resin (cost-push, hard to fall — lock 2–3 months immediately), High-end PI film (supply deficit — pre-stock)
• Hold & Watch: Carbon fiber (rebound but high inventory — buy in batches), PEEK industrial grade (domestic capacity caps price — JIT), Specialty ceramic raw materials (ample supply — JIT)

1. Executive Summary

On 7 September 2026, the six tracked new-materials keywords—PTFE (polytetrafluoroethylene), PEEK (polyetheretherketone), carbon fiber, advanced/special ceramics, electronic chemicals and aerogel—are all in a high-attention, high-growth and increasingly fragmented upcycle. Four common drivers dominate: AI computing infrastructure, semiconductor localization, new energy (solid-state batteries / energy storage / wind power / hydrogen) and the low-altitude economy. Search heat and competition intensity are rising in tandem, while import substitution of high-end grades remains the most structurally certain long-term opportunity.

2. Heat · Competition · Trend Overview

Keyword	Heat	Competition	Trend	Size / Growth	Core Driver
PTFE	High	Med-High	Rising	~USD 8.5B / +6.8%	AI compute + semiconductor + hydrogen; June price hike
PEEK	High	High	Rising	~USD 1.86B / +8-14%	Humanoid robots + 800V platform + semiconductor localization
Carbon Fiber	Very High	Medium	Rising	~USD 38B / 18% CAGR	Large wind blades + Type-IV hydrogen tanks + low-altitude economy
Special Ceramics	Med-High	High	Rising	~USD 128.5B / +11.5%	Semiconductor ESC + Si3N4 bearings + solid-state batteries
Electronic Chemicals	Very High	High	Rising	USD 74.2B global / RMB 235B China	Import substitution + AI compute + advanced packaging
Aerogel	High	Medium	Rising	~USD 5.8B / +17.4%	Mandatory EV battery standard + storage fire safety

3. In-Depth Analysis by Keyword

1. PTFE (Polytetrafluoroethylene)

Heat: High. In June 2026 major fluorochemical producers raised prices across the fluoropolymer range by 5%; PTFE prices are up 23.81% YoY, ending the 2023-2025 price war. Global market size is about USD 8.5B, with electronics/electrical overtaking anti-corrosion as the largest application (31.2% share).

Competition: Medium-High. CR5 is about 68%; China holds 67% of global capacity but remains 21-35% import-dependent on high-end modified and ultra-fine grades. PFAS restrictions and fluorite costs are forcing out obsolete capacity, opening structural substitution space for short-chain fluoropolymer processes.

Trend: Rising. Semiconductor cleaning equipment, hydrogen electrolyzer seals and 5G high-frequency copper-clad laminates drive demand for high-purity dispersion resin (+8.9%); PFAS-free and recycled PTFE (rPTFE) become the main technology threads.

2. PEEK (Polyetheretherketone)

Heat: High. 2026 global size about USD 1.86B, growth 8.4%-14%. Demand is pulled by 800V EV platforms, humanoid-robot joints, semiconductor wafer carriers and CMP rings; medical grade (+11.2%) and carbon-fiber-reinforced CF/PEEK (+9.7%) lead growth.

Competition: High. CR5 about 78%; UK’s Victrex holds ~40% share, with high certification barriers in medical/aerospace grades. Domestic players (Zhongyan, Pfluon) are breaking through; localization rate rose to 28.7% but remains in mid-low tiers.

Trend: Rising. Continuous CF-reinforced PEEK via 3D printing is maturing (tensile strength above 215 MPa); low-dielectric modification serves 5G/6G and 800V drives; in 2026 China’s capacity surpassed Europe’s for the first time.

3. Carbon Fiber

Heat: Very High. 2026 global about USD 38B (+18%), 18% CAGR through 2031. Wind power contributes over 55% of new demand; 18MW+ offshore turbines lift carbon-spar demand +19.3%; Type-IV hydrogen-tank fiber reaches 18 kt in 2026, projected above 50 kt by 2030.

Competition: Medium. Large-tow localization accelerating—China holds over 55% of global capacity in 2026, T700/T800 at scale, generic-grade price down 12%. But T800+ self-sufficiency is only 31%; high-end small-tow remains Japan-dominated.

Trend: Rising. Low-altitude economy (eVTOL airframe composites over 70%), robot arms and EV battery housings form new growth poles; thermoplastic carbon-fiber composites pass airworthiness review for post-2030 series installation.

4. Special Ceramics

Heat: Medium-High. 2026 global about USD 128.5B (+11.5%); functional ceramics share rises to 58%. Demand is ramping for semiconductor electrostatic chucks, silicon-nitride bearings and solid-state-battery ceramic separator coatings.

Competition: High. Japan dominates the high end (MLCC and precision ceramic parts ~61% global); CR10 about 47%. Chinese firms hold 9 of the top-20 seats, yet high-end Si3N4/SiC self-sufficiency is below 30%.

Trend: Rising. Silicon nitride (+14.2%) and silicon carbide (+12.6%) grow fastest; 800V power-module insulation substrates, third-gen-semiconductor AlN substrates and biomedical zirconia keep penetrating; import-substitution window is opening.

5. Electronic Chemicals

Heat: Very High. 2026 global USD 74.2B (+9%); China’s market exceeds RMB 235B (+13.8%). Semiconductor manufacturing is 47.6% of demand; ArF/EUV photoresist, fluorinated specialty gases and advanced-packaging materials grow over 14%.

Competition: High. High-end remains import-dependent: G5 ultra-high-purity wet chemicals localization only ~12%, high-end ArF photoresist below 8%, some high-purity specialty gases below 10%; Japan/US/Korea dominate photoresist and gases.

Trend: Rising. Substitution shifts from “mid-low” to “high-end breakthrough”—EUV-support reagents, ArF photoresist and high-purity specialty gases are the priority breakthrough targets; AI compute and HBM expansion lift wet-chemical unit consumption +27%.

6. Aerogel

Heat: High. 2026 global about USD 5.8B (+17.4%); lithium-battery thermal-pad demand +45% YoY. From 1 July 2026, GB 38031-2025 “Electric Vehicle Traction Battery Safety Requirements” took effect, shifting thermal-propagation control from “optional” to “mandatory”.

Competition: Medium. Generic aerogel blankets face saturated capacity and price wars; high-precision, high-flame-retardant products for power and premium storage are supply-tight, with automotive-grade and storage-grade certification as barriers.

Trend: Rising. Policy-mandated substitution window; new energy (battery + storage + vehicle thermal management) and building energy efficiency (GB/T 46993-2025) are dual engines; ambient-pressure drying cuts cost and drives mid-tier penetration.

4. Today’s Long-Tail Keyword Recommendations (8)

1. PTFE semiconductor-grade high-purity dispersion resin import substitution
2. PEEK carbon-fiber-reinforced composite humanoid-robot joints
3. Large-tow carbon fiber wind-blade pultrusion plate price trend
4. Silicon-nitride ceramic bearings for EV drive systems
5. ArF photoresist domestic substitution progress 2026
6. Aerogel power-battery thermal pad automotive-grade certification standard
7. Electronic-grade hydrofluoric acid G5 ultra-high-purity wet-chemical capacity
8. Type-IV hydrogen storage tank carbon-fiber wrapping material suppliers

5. Action Recommendations

• Priority 1: Target high-intent long tails like “ArF photoresist domestic substitution” and “electronic-grade hydrofluoric acid G5″—high competition but maximum conversion value; pair with policy and capacity-map content.
• Priority 2: “Aerogel automotive-grade certification” and “Type-IV hydrogen-tank carbon fiber” enjoy policy-mandated / emerging-scenario dividends; run content plus supplier-list operations in parallel.
• Priority 3: PEEK x humanoids and carbon-fiber x eVTOL are high-growth narratives suited to owning category mindshare; pre-stock technical explainer assets.
• Monitoring: Feed all long tails into the content pipeline; track indexing and ranking weekly, review heat/competition shifts monthly.

Sources: IIM, ChinaIRN, Mordor Intelligence, GGII, BJX Power and other public industry reports (2026).

1. Executive Summary

On 7 September 2026, the six tracked new-materials keywords—PTFE (polytetrafluoroethylene), PEEK (polyetheretherketone), carbon fiber, advanced/special ceramics, electronic chemicals and aerogel—are all in a high-attention, high-growth and increasingly fragmented upcycle. Four common drivers dominate: AI computing infrastructure, semiconductor localization, new energy (solid-state batteries / energy storage / wind power / hydrogen) and the low-altitude economy. Search heat and competition intensity are rising in tandem, while import substitution of high-end grades remains the most structurally certain long-term opportunity.

2. Heat · Competition · Trend Overview

Keyword	Heat	Competition	Trend	Size / Growth	Core Driver
PTFE	High	Med-High	Rising	~USD 8.5B / +6.8%	AI compute + semiconductor + hydrogen; June price hike
PEEK	High	High	Rising	~USD 1.86B / +8-14%	Humanoid robots + 800V platform + semiconductor localization
Carbon Fiber	Very High	Medium	Rising	~USD 38B / 18% CAGR	Large wind blades + Type-IV hydrogen tanks + low-altitude economy
Special Ceramics	Med-High	High	Rising	~USD 128.5B / +11.5%	Semiconductor ESC + Si3N4 bearings + solid-state batteries
Electronic Chemicals	Very High	High	Rising	USD 74.2B global / RMB 235B China	Import substitution + AI compute + advanced packaging
Aerogel	High	Medium	Rising	~USD 5.8B / +17.4%	Mandatory EV battery standard + storage fire safety

3. In-Depth Analysis by Keyword

1. PTFE (Polytetrafluoroethylene)

Heat: High. In June 2026 major fluorochemical producers raised prices across the fluoropolymer range by 5%; PTFE prices are up 23.81% YoY, ending the 2023-2025 price war. Global market size is about USD 8.5B, with electronics/electrical overtaking anti-corrosion as the largest application (31.2% share).

Competition: Medium-High. CR5 is about 68%; China holds 67% of global capacity but remains 21-35% import-dependent on high-end modified and ultra-fine grades. PFAS restrictions and fluorite costs are forcing out obsolete capacity, opening structural substitution space for short-chain fluoropolymer processes.

Trend: Rising. Semiconductor cleaning equipment, hydrogen electrolyzer seals and 5G high-frequency copper-clad laminates drive demand for high-purity dispersion resin (+8.9%); PFAS-free and recycled PTFE (rPTFE) become the main technology threads.

2. PEEK (Polyetheretherketone)

Heat: High. 2026 global size about USD 1.86B, growth 8.4%-14%. Demand is pulled by 800V EV platforms, humanoid-robot joints, semiconductor wafer carriers and CMP rings; medical grade (+11.2%) and carbon-fiber-reinforced CF/PEEK (+9.7%) lead growth.

Competition: High. CR5 about 78%; UK’s Victrex holds ~40% share, with high certification barriers in medical/aerospace grades. Domestic players (Zhongyan, Pfluon) are breaking through; localization rate rose to 28.7% but remains in mid-low tiers.

Trend: Rising. Continuous CF-reinforced PEEK via 3D printing is maturing (tensile strength above 215 MPa); low-dielectric modification serves 5G/6G and 800V drives; in 2026 China’s capacity surpassed Europe’s for the first time.

3. Carbon Fiber

Heat: Very High. 2026 global about USD 38B (+18%), 18% CAGR through 2031. Wind power contributes over 55% of new demand; 18MW+ offshore turbines lift carbon-spar demand +19.3%; Type-IV hydrogen-tank fiber reaches 18 kt in 2026, projected above 50 kt by 2030.

Competition: Medium. Large-tow localization accelerating—China holds over 55% of global capacity in 2026, T700/T800 at scale, generic-grade price down 12%. But T800+ self-sufficiency is only 31%; high-end small-tow remains Japan-dominated.

Trend: Rising. Low-altitude economy (eVTOL airframe composites over 70%), robot arms and EV battery housings form new growth poles; thermoplastic carbon-fiber composites pass airworthiness review for post-2030 series installation.

4. Special Ceramics

Heat: Medium-High. 2026 global about USD 128.5B (+11.5%); functional ceramics share rises to 58%. Demand is ramping for semiconductor electrostatic chucks, silicon-nitride bearings and solid-state-battery ceramic separator coatings.

Competition: High. Japan dominates the high end (MLCC and precision ceramic parts ~61% global); CR10 about 47%. Chinese firms hold 9 of the top-20 seats, yet high-end Si3N4/SiC self-sufficiency is below 30%.

Trend: Rising. Silicon nitride (+14.2%) and silicon carbide (+12.6%) grow fastest; 800V power-module insulation substrates, third-gen-semiconductor AlN substrates and biomedical zirconia keep penetrating; import-substitution window is opening.

5. Electronic Chemicals

Heat: Very High. 2026 global USD 74.2B (+9%); China’s market exceeds RMB 235B (+13.8%). Semiconductor manufacturing is 47.6% of demand; ArF/EUV photoresist, fluorinated specialty gases and advanced-packaging materials grow over 14%.

Competition: High. High-end remains import-dependent: G5 ultra-high-purity wet chemicals localization only ~12%, high-end ArF photoresist below 8%, some high-purity specialty gases below 10%; Japan/US/Korea dominate photoresist and gases.

Trend: Rising. Substitution shifts from “mid-low” to “high-end breakthrough”—EUV-support reagents, ArF photoresist and high-purity specialty gases are the priority breakthrough targets; AI compute and HBM expansion lift wet-chemical unit consumption +27%.

6. Aerogel

Heat: High. 2026 global about USD 5.8B (+17.4%); lithium-battery thermal-pad demand +45% YoY. From 1 July 2026, GB 38031-2025 “Electric Vehicle Traction Battery Safety Requirements” took effect, shifting thermal-propagation control from “optional” to “mandatory”.

Competition: Medium. Generic aerogel blankets face saturated capacity and price wars; high-precision, high-flame-retardant products for power and premium storage are supply-tight, with automotive-grade and storage-grade certification as barriers.

Trend: Rising. Policy-mandated substitution window; new energy (battery + storage + vehicle thermal management) and building energy efficiency (GB/T 46993-2025) are dual engines; ambient-pressure drying cuts cost and drives mid-tier penetration.

4. Today’s Long-Tail Keyword Recommendations (8)

1. PTFE semiconductor-grade high-purity dispersion resin import substitution
2. PEEK carbon-fiber-reinforced composite humanoid-robot joints
3. Large-tow carbon fiber wind-blade pultrusion plate price trend
4. Silicon-nitride ceramic bearings for EV drive systems
5. ArF photoresist domestic substitution progress 2026
6. Aerogel power-battery thermal pad automotive-grade certification standard
7. Electronic-grade hydrofluoric acid G5 ultra-high-purity wet-chemical capacity
8. Type-IV hydrogen storage tank carbon-fiber wrapping material suppliers

5. Action Recommendations

• Priority 1: Target high-intent long tails like “ArF photoresist domestic substitution” and “electronic-grade hydrofluoric acid G5″—high competition but maximum conversion value; pair with policy and capacity-map content.
• Priority 2: “Aerogel automotive-grade certification” and “Type-IV hydrogen-tank carbon fiber” enjoy policy-mandated / emerging-scenario dividends; run content plus supplier-list operations in parallel.
• Priority 3: PEEK x humanoids and carbon-fiber x eVTOL are high-growth narratives suited to owning category mindshare; pre-stock technical explainer assets.
• Monitoring: Feed all long tails into the content pipeline; track indexing and ranking weekly, review heat/competition shifts monthly.

Sources: IIM, ChinaIRN, Mordor Intelligence, GGII, BJX Power and other public industry reports (2026).

Price Trend Daily Report 2026-09-06

Price Overview

Material	Current Price Range	WoW	Trend
PTFE Resin	Suspension medium-particle RMB 32k–34k/t; Dispersion resin RMB 50k–54k/t	+1.5% / 0%	Rising, stabilizing
PEEK Resin	Domestic standard grade RMB 300k–400k/t; Import grade RMB 600k–800k/t	+1.0%~1.5%	Stable with slight uptick
Carbon Fiber	T300 grade RMB 140k–160k/t; T700 grade RMB 180k–220k/t	+1.0%	Bottom recovery
PI Film	Standard electronic grade RMB 300–600/kg; High-end semiconductor grade RMB 800–1,500/kg	0% / +0.5%	High-end firm
Specialty Ceramic Raw Materials	Alumina RMB 2,700–2,900/t; Silicon nitride powder RMB 80k–150k/t	+0.5%	Flat with slight rise

Key Movements

• PTFE Resin: Suspension medium-particle +1.5%. Upstream feedstock (fluorspar, hydrofluoric acid) remains elevated — hydrofluoric acid is up +44.77% YoY and fluorspar +5.46% MoM — and producers are holding prices firm. After a sharp +30% spike in July, the gain has narrowed markedly, entering a high-level consolidation. Dispersion resin supply-demand is balanced and prices are steady.
• Carbon Fiber: T300/T700 both +1.0%. Toray raised its TORAYCA series 10%–20% from Jan 2026, with Jilin Chemical Fiber following; the key feedstock acrylonitrile hit a multi-year high in August (~RMB 11,700/t at East China ports), giving clear cost-push support. Industry inventories have fallen from their highs and a bottom-recovery signal is confirmed.
• PEEK Resin: +1.0%~1.5%. Lightweighting demand from robotics, the low-altitude economy and flying cars is ramping up, with annual demand growth of ~14%–17%; domestic substitution capacity surpassed 10kt in 2026 and its market share is heading toward 60%, lifting the price center steadily.
• PI Film: Standard grades stable, high-end firm. Demand from 5G, flexible displays, new energy and AI-server thermal management supports the market and domestic substitution is accelerating; however, ample supply of standard grades caps gains, while high-end electronic/semiconductor grades remain firm on a supply gap (globally ~10kt).
• Specialty Ceramic Raw Materials: Alumina +0.5%. Bauxite cost support is strengthening but the overall oversupply structure remains, limiting upside; high-end powders such as silicon nitride and zirconia are stable-to-tight, buoyed by new-energy and semiconductor demand.

Impact Analysis

• Procurement cost: After its earlier sharp rise, PTFE sits at a relatively high level for the past three years, pressuring costs for anti-corrosion linings and seals — lock in 2–3 months of inventory. Carbon fiber’s bottom recovery will push composite material costs mildly higher over the medium term. High-end PI film stays firm — place orders 3 months ahead. Specialty ceramic raw materials are overall benign, with limited cost impact.
• Supply chain: PTFE’s fluorspar supply cannot be eased near-term and supplier lead times are lengthening (raise inventory buffer from 30 to 45 days). Carbon fiber localization exceeds 86%, improving autonomy but intensifying price competition. High-end PI film remains highly dependent on imports (DuPont, Kaneka, UBE, SK); under geopolitical/trade friction, supply-disruption risk outweighs price risk — dual sourcing is advised for critical programs.

Action Recommendations

• Lock in now: ① PTFE resin (cost-push and tight supply — lock 2–3 months of volume immediately); ② Carbon fiber T700 (bottom recovery confirmed — sign Q3–Q4 long-term contracts); ③ High-end/semiconductor PI film (supply gap locked through 2027 — order 3 months ahead).
• Hold and watch: ① Domestic standard-grade PEEK (capacity expansion caps prices — procure in batches opportunistically); ② Standard electronic-grade PI film and alumina (ample supply, no near-term surge driver — maintain just-in-time purchasing).